JPH0519956Y2 - - Google Patents
Info
- Publication number
- JPH0519956Y2 JPH0519956Y2 JP1986166391U JP16639186U JPH0519956Y2 JP H0519956 Y2 JPH0519956 Y2 JP H0519956Y2 JP 1986166391 U JP1986166391 U JP 1986166391U JP 16639186 U JP16639186 U JP 16639186U JP H0519956 Y2 JPH0519956 Y2 JP H0519956Y2
- Authority
- JP
- Japan
- Prior art keywords
- outer lead
- base film
- circuit board
- chip
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986166391U JPH0519956Y2 (en]) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986166391U JPH0519956Y2 (en]) | 1986-10-28 | 1986-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6370150U JPS6370150U (en]) | 1988-05-11 |
JPH0519956Y2 true JPH0519956Y2 (en]) | 1993-05-25 |
Family
ID=31097319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986166391U Expired - Lifetime JPH0519956Y2 (en]) | 1986-10-28 | 1986-10-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0519956Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
JPS6384990A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 携帯可能媒体 |
-
1986
- 1986-10-28 JP JP1986166391U patent/JPH0519956Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6370150U (en]) | 1988-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3502776B2 (ja) | バンプ付き金属箔及び回路基板及びこれを用いた半導体装置 | |
KR100346899B1 (ko) | 반도체장치 및 그 제조방법 | |
JPH11126795A (ja) | 実装基板およびその製造方法ならびに電子部品の実装方法 | |
JPH0519956Y2 (en]) | ||
JPS6242548Y2 (en]) | ||
JPS635248Y2 (en]) | ||
JP2715810B2 (ja) | フィルムキャリア半導体装置とその製造方法 | |
JP3352471B2 (ja) | フィルムキャリア | |
JP2536568B2 (ja) | リ―ドフレ―ム | |
JPH0442937Y2 (en]) | ||
JPS5824459Y2 (ja) | 電気部品装着基板 | |
JPH01120856A (ja) | リードフレーム | |
JPS6070752A (ja) | 半導体装置の製造方法 | |
JPH0747901Y2 (ja) | 印刷配線板 | |
JPH033972Y2 (en]) | ||
JPS63160262A (ja) | リ−ドフレ−ムおよびそれを用いた半導体装置 | |
JP2542125Y2 (ja) | 分割回路基板 | |
JPH046212Y2 (en]) | ||
JPH0423321Y2 (en]) | ||
JP2777114B2 (ja) | テープキャリア | |
JPH0533839B2 (en]) | ||
JPH0751794Y2 (ja) | 半導体の実装構造 | |
JP2811888B2 (ja) | キャリアフィルム及びその製造方法並びに半導体装置 | |
JPH03233950A (ja) | フレキシブルテープ及び半導体チップの実装構造 | |
JPH0585042U (ja) | マザーボードとサブボードの接続構造 |